Reasons for poor soldering design

Why are the pads connected to the central large solder pads prone to cold soldering?

Since the GND pad is directly connected to the center heat dissipation pad without any solder mask isolation in between, during reflow soldering, the solder paste will flow from the GND pad to the center pad, resulting in insufficient solder on the GND pad, causing poor soldering or cold solder joints.

We recommend that a solder mask isolation area be added between the GND pad and the large center pad to ensure a stable solder amount on each pad and more reliable solder joints.