BGA (Ball Grid Array) Design Requirements

Reason for Failed Review:

According to PCBfast’s standard manufacturing capabilities, the following design rules must be met for BGA pad layouts (as shown in the figure below):

• Minimum BGA pad diameter: ≥ 0.25 mm

• Minimum spacing between BGA pad and copper trace: ≥ 0.15 mm

• Minimum distance from BGA pad to trace (for 1 oz copper): ≥ 0.15 mm

• Minimum distance between BGA pads: ≥ 0.35 mm

At present, PCBfast’s advanced PCB manufacturing line is capable of achieving the following high-precision parameters:

• Minimum BGA pad diameter: 0.20 mm (prototype limit: 0.15 mm)

• Minimum spacing between BGA pad and trace: 3 mil (limit: 2.5 mil)

• Minimum BGA pitch: 0.4 mm (standard: 0.5 mm)

Please note that pushing these limits is challenging — it significantly increases production difficulty, reduces yield rate, and raises manufacturing costs.

PCBfast Suggestions:

• Please update your Gerber files according to the above design requirements and resubmit online for engineering review.

• If your design requires 0.20 mm BGA pads or any parameters beyond our standard production limits, please contact your PCBfast sales representative.

We can quote and arrange production through our high-precision advanced fabrication line to ensure reliability and quality.

Following these guidelines ensures optimal soldering performance, alignment accuracy, and manufacturability for BGA designs.